Hengpeng Enterprise Group's Wafer Bonding Machine (WSS) project won the second prize in the district division of the "Innovation and Entrepreneurship Wings" project organized by the Shanghai Science and Technology Commission.
In April 2022, the company received an invitation to participate in the "5th 'China Chuangyi' Entrepreneurship and Innovation Competition Shanghai Trials Jing'an Division" organized by the Science and Technology Commission of Jing'an District.
A subsidiary of Hengpeng Enterprise Group, with the wafer bonding machine project "WSS" as its entry plan, participated in the preliminary roadshow on June 20 and the final roadshow on June 28. Under the guidance of the company's management and the joint efforts of the marketing department, it won the second prize in the division and special subsidy funds.
Principle of Film Lamination for WSS Wafer Temporary Bonding System 》》
Product Information of WSS Wafer Temporary Bonding Machine and Debonding Machine 》》
