Tamura Solder Paste
TAMURA Solder Paste
TLF204-205-HF
High-reliability Solder Paste
Faced with the continuous high temperatures in automotive electronic compartments and the stringent requirements of precision components in consumer electronics, the long-term reliability of solder joints has become a weighing on the minds of every process engineer.
In the field of surface mount technology, the reliability of soldering materials directly determines the quality and lifespan of the final product. In the face of increasingly harsh application environments and environmental regulations, choosing a high-performance lead-free solder paste is crucial.
Tamura solder paste TLF204-205HF, as a highly respected high-end product in the industry, its excellent high-temperature stability and outstanding soldering performance provide an ideal solution for fields such as automotive electronics and precision electronic component soldering.
1. Core Parameters and Product Positioning of TLF204-205HF
As a representative product in Tamura's HF series, TLF204-205HF is specially designed for demanding SMT soldering scenarios. This solder paste adopts the current mainstream SAC305 lead-free alloy system, with a specific composition of Sn96.5%/Ag3.0%/Cu0.5%.
This mature ratio ensures the stability of the material under high-temperature conditions while meeting environmental regulations worldwide.
In terms of basic physical parameters, the melting point range of TLF204-205HF is controlled between 216~220℃. This range not only ensures a sufficient soldering temperature window but also avoids potential damage to heat-sensitive components.
Its solder powder particle size distribution is in the range of 25-38μm, with extremely high sphericity. This not only helps to improve the uniformity of printing but also can significantly reduce the generation of solder balls during the soldering process.
In terms of viscosity, this solder paste shows excellent stability. Even during 8 hours of continuous production, the change in its viscosity over time is minimal. This characteristic is crucial for ensuring the consistency of mass production, and is particularly suitable for production scenarios with high stability requirements such as automotive electronics.
Parameters of TLF204-205HF High-Reliability Solder Paste：
Project | Feature（TLF204-205HF） | Test Method |
Alloy composition | Sn 96.5/3.0Ag/0.5Cu | JIS Z 3282(2006) |
Melting point | 216～220℃ | DSC Measurement shall prevail |
Tin powder type | Type4 | Laser folding method |
Flux type | ROLO | IPC J-STD-004C |
Flux content | 11.1% | JIS Z 3197(2012) |
Chlorine content | 11.1% | JIS Z 3197(2012) |
Viscosity | 190 Pa·s | JIS Z 3284-3(2014) brookfield viscometer 25℃ |
II. Product Advantages and Application Scenarios
Compared with similar products on the market, Tamura TLF204-205HF solder paste has advantages in multiple dimensions. Especially in terms of high-temperature resistance and solder joint strength, this product performs excellently and can meet the needs of various harsh application scenarios.
Many factories encounter the problem of rapid viscosity decline after printing when using ordinary solder paste, while the viscosity retention of TLF204-205HF can easily meet the requirement of 8-hour continuous printing.
In terms of antioxidant performance, the specially optimized flux system of this product can form an effective protective layer during the reflow soldering process, reduce solder oxidation, thereby significantly improving the consistency and appearance quality of solder joints. This is particularly important for consumer electronics manufacturing that pursues high yield rates.
Environmental compliance is also a factor that must be considered in modern electronics manufacturing. Tamura TLF204-205HF fully complies with the RoHS 2.0 environmental standards, with halogen content strictly controlled below 0.0%, meeting the restrictions on hazardous substances in major global markets.
This product performs particularly well in applications in the fields of automotive electronics, industrial control, and high-end consumer electronics. In the welding of engine compartment components in automotive electronics, the ambient temperature is often as high as 80°C or above, and it needs to withstand continuous vibration and impact. The high-temperature stability and excellent anti-fatigue characteristics of TLF204-205HF solder paste can ensure that there is no long-term risk of solder joint failure.
