RMA-20-31 Features:

· The occurrence of “chip side” balls is practically on-existent

· Residual flux after reflow is uniform. So that defective conductivity “by in-circuit tester” will not occur

· Having a good solder ability, adequate wettability is shown on various parts

· Stable printability is obtained with little change in viscosity during continuous printing

RMA-20-31 Parameter:

• TAMURARMA-010-FP
  
  This paste, using high-thixotropic flux, has an excellent resolution and continuous printability, and ensures stable printing of 0.3mm fine pitch patterns for QFPs.
• TAMURARMA-20-21T
  
  RMA-20-21T is a solder paste consisting of special RMA flux and spherical solder powder with little oxides. With excellent resolution and stability in continuous printing, fine patterns of 0.3mm pitches can be printed with good precision. Furthermore, the flux being equivalent to RMA conforming to MIL-F-14256F, an excellent reliability can be obtained without washing.
• TAMURARMA-20-21L
  
  RMA-20-21L is a solder paste the flux described type L0 in J-STD and spherical solder powder containing very little oxides. This paste has an excellent continuous printed resolution and has a good printing precision of 0.3mm pitch fine pattern. Furthermore, the flux residue after soldering will leave a highly reliable coat excellent in insulation without washing.
• TAMURARMA-20-21A
  
  RMA-20-21A is the solder paste of fine pattern correspondence that used the sphere solder powder with little oxide and special flux. Being excellent in resolution and stability for continuous printing, the paste enables to produce a high-precision printing of 0.3mm pitch.
• TAMURARMA-20-21
  
  RMA-20-21 is solder paste using a special non-halogen type RMA flux and spherical solder powder with little oxide. The paste is excellent in continuous printability and ensures printing of 0.3mm pitch with a high accuracy. Furthermore, the flux being equivalent to the RMA as specified in MIL-F-14256F, it will enable to have an excellent reliability with no washing.
• TAMURARMA-020-FP
  
  RMA-020-FP is a solder paste consisting of an RMA type flux that satisfies the MIL-F-14256F specification and spherical solder power with little oxide. This paste, using a newly developed high-thixotropic flux, excels in resolution and continuous-printability, and ensures stable printing of 0.3 mm pitch fine patterns for QFP, etc.